JPH0533535B2 - - Google Patents
Info
- Publication number
- JPH0533535B2 JPH0533535B2 JP18090185A JP18090185A JPH0533535B2 JP H0533535 B2 JPH0533535 B2 JP H0533535B2 JP 18090185 A JP18090185 A JP 18090185A JP 18090185 A JP18090185 A JP 18090185A JP H0533535 B2 JPH0533535 B2 JP H0533535B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pin
- heat sink
- wiring
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920006015 heat resistant resin Polymers 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000003491 array Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090185A JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
| EP86108770A EP0218796B1 (en) | 1985-08-16 | 1986-06-27 | Semiconductor device comprising a plug-in-type package |
| DE8686108770T DE3675321D1 (de) | 1985-08-16 | 1986-06-27 | Halbleiteranordnung mit packung vom steckerstifttyp. |
| US06/880,832 US4823234A (en) | 1985-08-16 | 1986-07-01 | Semiconductor device and its manufacture |
| KR1019860006161A KR870002647A (ko) | 1985-08-16 | 1986-07-28 | 반도체장치 및 그 제조방법 |
| CN198686105249A CN86105249A (zh) | 1985-08-16 | 1986-08-16 | 半导体器件及其制造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090185A JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240749A JPS6240749A (ja) | 1987-02-21 |
| JPH0533535B2 true JPH0533535B2 (en]) | 1993-05-19 |
Family
ID=16091288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18090185A Granted JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240749A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62189743A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | 配線回路体 |
| JPS62189742A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | ピングリツドアレイ |
| JP2770947B2 (ja) * | 1988-02-05 | 1998-07-02 | シチズン時計株式会社 | 樹脂封止型半導体装置及びその製造方法 |
-
1985
- 1985-08-16 JP JP18090185A patent/JPS6240749A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6240749A (ja) | 1987-02-21 |
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